FRAME STRUCTURE AND ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide an inexpensive high rigidity frame structure with high dimensional precision, and to provide an electronic apparatus equipped with that frame structure. SOLUTION: The frame structure has side frames 12 and 13 formed by bending the opposite ends of a main frame 11 at...

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Bibliographische Detailangaben
Hauptverfasser:	KINOSHITA MASAAKI, AONO MUNETOYO
Format:	Patent
Sprache:	eng
Schlagworte:	CORRECTION OF TYPOGRAPHICAL ERRORS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an inexpensive high rigidity frame structure with high dimensional precision, and to provide an electronic apparatus equipped with that frame structure. SOLUTION: The frame structure has side frames 12 and 13 formed by bending the opposite ends of a main frame 11 at a substantially right angle and across which a component is bridged and at least one edge 12d of the side frame is contracted. Since the main frame and the side frame are integrated, dimensional precision and rigidity at that portion can be enhanced and cost increase can be suppressed by decreasing the number of components. Rigidity at that portion can be enhanced furthermore, because the edge of the side frame is contracted. COPYRIGHT: (C)2007,JPO&INPIT