MOUNTING SUBSTRATE

PROBLEM TO BE SOLVED: To provide an electronic component of which the impact at punching with a die is absorbed for improved reliability of a substrate with a simple substrate structure. SOLUTION: A dummy wiring is provided at least in the region of a mounting substrate 6 which is punched out with a...

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Bibliographische Detailangaben
1. Verfasser:	YUGAWA MASAYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electronic component of which the impact at punching with a die is absorbed for improved reliability of a substrate with a simple substrate structure. SOLUTION: A dummy wiring is provided at least in the region of a mounting substrate 6 which is punched out with a die. A resist and resin 9 arranged at the upper part of the dummy wiring are removed. So, the impact at punching out with a die is absorbed and dispersed. Thus, even with a simple substrate structure, no problem of warping or deflection of a frame-like mounting substrate 6 occurs, and cracking can be prevented that accompanies punching by the die with the mounting substrate 6 for improved reliability of electronic components. COPYRIGHT: (C)2007,JPO&INPIT