METHOD FOR PRODUCING METALLIC OXIDE MICROPARTICLE FOR ABRASIVE, ABRASIVE, AND METHOD FOR GRINDING SUBSTRATE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE BY USING THE ABRASIVE

PROBLEM TO BE SOLVED: To provide a method for producing metallic oxide microparticles for abrasive, capable of performing CMP in a short time without causing grinding defects on a silicon oxide membrane, a metal embedded membrane and the like in CMP technologies such as interlayer insulating film pl...

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Bibliographische Detailangaben
Hauptverfasser:	TERASAKI HIROKI, MACHII YOICHI, YOSHIDA MASATO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for producing metallic oxide microparticles for abrasive, capable of performing CMP in a short time without causing grinding defects on a silicon oxide membrane, a metal embedded membrane and the like in CMP technologies such as interlayer insulating film planarization, shallow trench separation forming and metal embedding wiring forming, to provide an abrasive containing the metallic oxide microparticles produced by the method, and to provide a method for grinding substrates and a method for producing the semiconductor devices by using the abrasive. SOLUTION: The method for producing the metallic oxide microparticles for an abrasive is characterized by finely forming droplets from a solution containing a metallic compound and an organic material and heat treating the droplets. The abrasive comprises the metallic oxide microparticles for an abrasive, produced by the method. The method for grinding the substrates and the method for producing the semiconductor devices by using the abrasive are provided. COPYRIGHT: (C)2007,JPO&INPIT