LASER CUTTING APPARATUS

PROBLEM TO BE SOLVED: To provide a laser cutting apparatus which enhances cutting quality of substrates. SOLUTION: The laser cutting apparatus with a predetermined cutting direction includes a laser unit to generate first laser beam and a cooling system and is used for cutting brittle substrates, an...

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Bibliographische Detailangaben
Hauptverfasser:	FU CHEN TSU, KO SHUNGAI, CHEN HSIEN TANG, TEI HOSEN, KYO SOFU, CHANG MING-HUI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING DEVICES USING STIMULATED EMISSION ELECTRICITY FREQUENCY-CHANGING GLASS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PERFORMING OPERATIONS PHYSICS SOLDERING OR UNSOLDERING TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TRANSPORTING WELDING WORKING BY LASER BEAM WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a laser cutting apparatus which enhances cutting quality of substrates. SOLUTION: The laser cutting apparatus with a predetermined cutting direction includes a laser unit to generate first laser beam and a cooling system and is used for cutting brittle substrates, and further includes a second laser unit which generates second laser beam; wherein the second laser beam previously forms a cutting line on the substrate, the first laser beam generates thermal expansion on the substrate by heating along the previous cutting line, and the cooling system is used for cooling the thermally expanded substrate. The cutting quality is enhanced and rate of fair quality in products is increased as cracks are not formed arising from a previous cutting line formed by traditional wheel cutters or diamond cutters, since the laser cutting apparatus forms the cutting line on the substrate previously by means of the laser beam. COPYRIGHT: (C)2007,JPO&INPIT