METHOD OF CUTTING OR GRINDING BRITTLE MATERIAL AND CHIP-STICKING PREVENTIVE AGENT

PROBLEM TO BE SOLVED: To provide a method of cutting or grinding brittle materials and a chip-sticking preventive agent by which the sticking of chips or a ground powder generated in machining a brittle material to a workpiece is controlled, the cleaning after machining is made easier and the loweri...

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Bibliographische Detailangaben
Hauptverfasser: RYUU ROISEN, TAKAO MASANORI, TAKEMURA TOMOYOSHI, ISHIKAWA TAKATOSHI, YOSHIDA MIKI, SANDO HIDEYUKI, HARADA SEISHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method of cutting or grinding brittle materials and a chip-sticking preventive agent by which the sticking of chips or a ground powder generated in machining a brittle material to a workpiece is controlled, the cleaning after machining is made easier and the lowering of a yield due to poor cleaning is avoided. SOLUTION: The method of cutting or grinding brittle materials is characterized in that cutting or grinding brittle materials is conducted by using a brittle material-machining auxiliary agent which is obtained by mixing water and a large molecular weight water-soluble cationic polymer with an average weight-average molecular weight of 70-70,000 (e.g. a polyethylene imine, a dicyandiamide, a quaternary ammonium salt and the like), contains the large molecular weight water-soluble cationic polymer in an amount of 5-10,000 ppm and has a pH of 6-9. The method of cutting or grinding brittle materials is favorably applied for cutting or grinding brittle, particularly cutting, precision-polishing and dicing materials including glass, ceramics or silicon. COPYRIGHT: (C)2007,JPO&INPIT