LAMINATE AND ITS LASER PROCESSING METHOD

PROBLEM TO BE SOLVED: To provide a laminate capable of preventing the peeling or separation of a film at the time of laser processing, and its laser processing method. SOLUTION: The laminate 1 comprises a substrate 2, the film 3 provided on the substrate 2 and the heat conductive layer 4 provided be...

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Bibliographische Detailangaben
Hauptverfasser:	SHIBUE AKIRA, KOMURO EIKI, OIKAWA YASUNOBU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a laminate capable of preventing the peeling or separation of a film at the time of laser processing, and its laser processing method. SOLUTION: The laminate 1 comprises a substrate 2, the film 3 provided on the substrate 2 and the heat conductive layer 4 provided between the substrate 2 and the film 3. The heat conductive layer 4 has heat conductivity higher than that of the film 3. When the substrate 2 is irradiated with a laser beam from the side opposite to the film 3 so that the laser beam passes through the heat conductive layer 4, a through-hole 5 is formed to the laminate 1. At this time, the heat caused by the laser beam L is absorbed by the heat conductive layer 4, so that the transmission of heat to the film 3 is sufficiently prevented. By this constitution, the peel on damage of the film 3 can be prevented. COPYRIGHT: (C)2007,JPO&INPIT