POLISHING METHOD

PROBLEM TO BE SOLVED: To provide a polishing method, which can polish the material to be polished with a high throughput, such as glass, semiconductors, dielectric substance/metal composite substances and integrated circuits, while supplying slurry on a polishing pad, and can increase the number of...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HANAMOTO MIYUKI, HONDA TOMOYUKI, JIYOU KUNITAKA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a polishing method, which can polish the material to be polished with a high throughput, such as glass, semiconductors, dielectric substance/metal composite substances and integrated circuits, while supplying slurry on a polishing pad, and can increase the number of process wafers in the polishing pad. SOLUTION: When the material to be polished is to be polished, while supplying slurry on the polishing pad, and when a dresser tool dresses the surface of the polishing pad during polishing in an in situ dressing, dressing time is 10-70% of the polishing time. COPYRIGHT: (C)2007,JPO&INPIT