CAPILLARY FOR WIRE BONDING DEVICE

PROBLEM TO BE SOLVED: To provide a capillary for a wire bonding device which can be effectively applied to the wiring bonding process of a plurality of pad layers and a Low-K package, that is, a package where the thickness of the layer of a metal oxide is extremely thin, and a low resistance value i...

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Bibliographische Detailangaben
Hauptverfasser:	LEE KANG YONG, MOON JUNG JU, SUNG HYUN BUM, LEE HAE BAL
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a capillary for a wire bonding device which can be effectively applied to the wiring bonding process of a plurality of pad layers and a Low-K package, that is, a package where the thickness of the layer of a metal oxide is extremely thin, and a low resistance value is shown. SOLUTION: This capillary for a wire bonding device is provided with a straight portion 100, a first taper-shaped bottleneck portion 101 extending upwards from the end of the capillary to a first step 103 with a first taper of 8 to 12°, and having a first height of 0.1 to 0.5mm from the end of the capillary to the first step 103 and a second taper-shaped bottleneck portion 102 extending upwards from the first step 103 of the first bottleneck portion 101 to a second step 103' on the border of the straight portion 100 with a second taper of 10 to 15°, and having a second height of 1.5 to 5.0mm from the end of the capillary to the second step 103'. COPYRIGHT: (C)2007,JPO&INPIT