FLEXIBLE CIRCUIT BOARD AND ITS PRODUCTION PROCESS

PROBLEM TO BE SOLVED: To provide a thin circuit board excellent in flexibility on which various circuit components are formed, and to provide its production process. SOLUTION: The flexible circuit board 10 comprises a flexible substrate 11, a wiring pattern 12 provided on at least one surface of the...

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Bibliographische Detailangaben
Hauptverfasser:	YAMAMOTO KENICHI, NISHIKURA TAKAHIRO, KOMYOJI DAIDO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a thin circuit board excellent in flexibility on which various circuit components are formed, and to provide its production process. SOLUTION: The flexible circuit board 10 comprises a flexible substrate 11, a wiring pattern 12 provided on at least one surface of the substrate 11, and a circuit component 15 formed integrally with the substrate 11 by filling a groove formed on one surface of the substrate 11 at a predetermined depth in a predetermined pattern with a predetermined material, wherein the wiring pattern 12 and the circuit component 15 are connected. COPYRIGHT: (C)2007,JPO&INPIT