PROCESS KIT AND TARGET FOR SUBSTRATE PROCESSING CHAMBER

PROBLEM TO BE SOLVED: To provide a process kit for reducing deposition of process deposits on chamber components and on an overhang edge of a substrate. SOLUTION: A deposition ring to be placed about a substrate support in a substrate processing chamber is equipped with an enclosure wall in which the plasma of process gas is formed to process the substrate and the substrate terminates in front of the overhang edge of the substrate. The deposition ring comprises an annular band 216 encircling the enclosure wall of the support and is arranged with a deposition-proof ring. The deposition-proof ring is equipped with: the annular band having an inner lip 218 which extends horizontally from the annular band, is nearly parallel to the enclosure wall of the support and terminates under the overhang edge of the substrate; a raised ridge 224; an inner open channel 230 which extends at least partially between the inner lip and the raised ridge under the overhang edge of the substrate; and a radially outward facing ledge 236 of the raised ridge. COPYRIGHT: (C)2007,JPO&INPIT