WAFER SUPPORTING MEMBER

PROBLEM TO BE SOLVED: To overcome the problem that a required thermal uniformity and temperature response cannot be obtained due to temperature variation in a wafer supporting member. SOLUTION: The wafer supporting member includes a plurality of resistance heating element zones on one main surface o...

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Bibliographische Detailangaben
1. Verfasser:	NAKAMURA TSUNEHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To overcome the problem that a required thermal uniformity and temperature response cannot be obtained due to temperature variation in a wafer supporting member. SOLUTION: The wafer supporting member includes a plurality of resistance heating element zones on one main surface of a plate-like ceramics, and a mounting face for mounting a wafer on the other main surface of the plate-like ceramics. The member has a power supply for independently supplying electric power to the resistance heating elements on the resistance heating element zones, and a metal case surrounding the power supply. The whole resistance heating element zones comprise a circular resistance heating element zone on the center, and resistance heating element zones inside three concentric circles on the outside of the circular resistance heating element zone. COPYRIGHT: (C)2007,JPO&INPIT