MULTILAYER PRINTED-CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR

PROBLEM TO BE SOLVED: To provide a multilayer printed-circuit board with a flexible portion and a rigid portion in which great flexibility is provided by resolving discontinuity in terms of structure and strength between the flexible portion and rigid portion, and a surface treatment process can be simplified, and to provide a manufacturing method therefor. SOLUTION: The multilayer printed circuit board 1 comprises the flexible portion Af constituted of a flexible base material 10 formed with an internal layer circuit patterns 12p and 13p, and the rigid portion As constituted of rigid base materials 20 formed with external circuit patterns 23p and 24p which are laminated above part of the flexible base material 10 via adhesive layers 15 and 16. The boundary between the flexible portion Af and rigid portion As is coated by a coating layer 30 that exposes an exposed portion 12pt of the internal layer circuit pattern 12p, to continuously coat the flexible base material 10 and rigid base material 20. Plated layers 37, 38 and 39 are formed by applying surface treatment to the exposed portion 12pt and external circuit patterns 23pt and 24pt. COPYRIGHT: (C)2007,JPO&INPIT