SUBSTRATE PROCESSING METHOD AND RINSE DEVICE

PROBLEM TO BE SOLVED: To improve a manufacturing yield of a resist pattern by removing unintended level difference of a substrate bevel and a resist film or a protective film of the substrate bevel which causes a source of dust, while securing the tracking ability of an immersion liquid. SOLUTION: A...

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Bibliographische Detailangaben
Hauptverfasser: TAKEISHI TOMOYUKI, ONISHI KIYONOBU, SHIOBARA HIDESHI, HAYAZAKI KEI, KAWAMURA DAISUKE, ITO SHINICHI, TOUKI TATSUHIKO
Format: Patent
Sprache:eng
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