SUBSTRATE PROCESSING METHOD AND RINSE DEVICE
PROBLEM TO BE SOLVED: To improve a manufacturing yield of a resist pattern by removing unintended level difference of a substrate bevel and a resist film or a protective film of the substrate bevel which causes a source of dust, while securing the tracking ability of an immersion liquid. SOLUTION: A...
Gespeichert in:
Hauptverfasser: | , , , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!