METHOD OF MANUFACTURING ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component which can prevent the occurrence of drawbacks such as peeling of a film and exposure of a blank in a terminal electrode. SOLUTION: In this method of manufacturing an electronic component, a conductive paste 40 is controlled in a state its actual temperature is at 120°C-180°C in a drying process. As described above, by setting the actual temperature of the conductive paste 40 at not less than 120°C, the conductive paste 40 can be sufficiently dried and film peeling of the terminal electrode 3 to be formed can be suppressed. Further, by setting the actual temperature of the conductive paste 40 at not more than 180°C, a rate of evaporation of a solvent can be uniformed on the center and the edge of the blank 2, and it is assumed that this can prevent the occurrence of a phenomenon in which the conductive paste 40 positioned on the edge of the blank 2 is initially shrunk and this drags the conductive paste 40 on the center of the blank 2. As a result, the occurrence of a recess and exposure of the blank can be suppressed on the center of the terminal electrode 3 acquired after drying. COPYRIGHT: (C)2007,JPO&INPIT