APPARATUS AND METHOD OF MOUNTING ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide an apparatus and a method of mounting electronic components which can efficiently perform three-dimensional component mounting operations for stack mounting. SOLUTION: In stack mounting in which components are sequentially stacked and mounted for each stage on a plur...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TAKURI AKIYOSHI, HIRATA SHUICHI, TSUJISAWA TAKAFUMI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an apparatus and a method of mounting electronic components which can efficiently perform three-dimensional component mounting operations for stack mounting. SOLUTION: In stack mounting in which components are sequentially stacked and mounted for each stage on a plurality of component stacking positions in a component stacking segment provided on a substrate, after completion of components mounting operations of all components belonging to the same stage in one component stacking segment, component mounting operations of components belonging to the stage subsequent to the above stage starts. This can reduce frequency of changes in mounting height of a mounting head and the applying height of an applying head as much as possible, and thus, the three-dimensional component mounting operations in stack mounting can be efficiently performed. COPYRIGHT: (C)2007,JPO&INPIT