SEMICONDUCTOR MODULE AND HEAT SINK THEREFOR

PROBLEM TO BE SOLVED: To provide a semiconductor module capable of solving the possibility that a semiconductor element mounted near the center of a circuit board might be destroyed owing to a load applied to a heat sink, even when reducing a contact of the heat sink with the circuit board as much a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	UEHARA SUMIO, AOKI SHUZO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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