SEMICONDUCTOR MODULE AND HEAT SINK THEREFOR

PROBLEM TO BE SOLVED: To provide a semiconductor module capable of solving the possibility that a semiconductor element mounted near the center of a circuit board might be destroyed owing to a load applied to a heat sink, even when reducing a contact of the heat sink with the circuit board as much as possible, and also capable of strongly mounting the heat sink without protruding from a peripheral edge of the circuit board. SOLUTION: The semiconductor module 10 is covered with heat sinks 12a, 12b mounted on opposite surfaces of the circuit board, such that the upper surface of the semiconductor element 17 mounted on opposite surfaces of a rectangular circuit board 11 is prevented from protruding from the board surface of the circuit board. In the semiconductor module, the heat sink is positioned to a predetermined position on the circuit board by a protruded portion constituting a pair of mounting parts 42 provided in the vicinity of a longitudinal center of the circuit board. Further, a part of the protrusion constituting the mounting part makes contact with the surface of the circuit board to which the part of the protrusion constituting the mounting part corresponds so that a part of the load applied to the vicinity of the center of the heat sink can be supported by the circuit board. COPYRIGHT: (C)2007,JPO&INPIT