SOLDER BUMP FORMATION EQUIPMENT

PROBLEM TO BE SOLVED: To provide solder bump formation equipment where electroplating tin does not oxidize. SOLUTION: Following processes are carried out in a series of equipment. (1) In vacuum equipment, oxide on a surface electroplated with tin is removed by argon plasma. (2) The surface is heated...

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Bibliographische Detailangaben
Hauptverfasser:	IKEDA HIROAKI, NAKA YASUHIRO, ISADA NAOYA, TENMYO HIROYUKI, ISHINO MASAKAZU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide solder bump formation equipment where electroplating tin does not oxidize. SOLUTION: Following processes are carried out in a series of equipment. (1) In vacuum equipment, oxide on a surface electroplated with tin is removed by argon plasma. (2) The surface is heated in vacuum or inert gas (argon, nitrogen, helium, or a gas obtained by mixing hydrogen in the inert gas for suppressing oxidization). (3) An adhesive is applied on the surface in the inert gas (argon, nitrogen, helium, or a gas obtained by mixing hydrogen in the inert gas for suppressing oxidization). (4) The adhesive is semi-cured in the inert gas (argon, nitrogen, helium, or a gas obtained by mixing hydrogen in the inert gas for suppressing oxidization). COPYRIGHT: (C)2007,JPO&INPIT