DEVICE AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

DEVICE AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide an electronic component mounting device along with an electronic component mounting method, capable of obtaining a flexible production form for a plurality of mixed kinds of substrates. SOLUTION: The electronic component mounting device is constituted by successively...

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1. Verfasser: TAKAICHI SUSUMU
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Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator TAKAICHI SUSUMU
description PROBLEM TO BE SOLVED: To provide an electronic component mounting device along with an electronic component mounting method, capable of obtaining a flexible production form for a plurality of mixed kinds of substrates. SOLUTION: The electronic component mounting device is constituted by successively connecting a plurality of unit mounting devices via substrate sorting and transferring parts. A substrate identification mark detector 15 detects a substrate identification mark with the use of a barcode mark which is attached to the substrate to be carried-in from an upstream side to the substrate sorting and transferring part. A substrate kind determining part 22 determines the kind of the substrate from the detection result. Based on the determination result, a control unit 20 reads a mounting program corresponding to the substrate kind from a program storage 21 and changes-over the mounting programs. Consequently, a mounting work is continuously performed with the plurality of mixed kinds of substrates as an object, so that the flexible production form is obtained. COPYRIGHT: (C)2007,JPO&INPIT
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title DEVICE AND METHOD FOR MOUNTING ELECTRONIC COMPONENT
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