DEVICE AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide an electronic component mounting device along with an electronic component mounting method, capable of obtaining a flexible production form for a plurality of mixed kinds of substrates. SOLUTION: The electronic component mounting device is constituted by successively...

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1. Verfasser: TAKAICHI SUSUMU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an electronic component mounting device along with an electronic component mounting method, capable of obtaining a flexible production form for a plurality of mixed kinds of substrates. SOLUTION: The electronic component mounting device is constituted by successively connecting a plurality of unit mounting devices via substrate sorting and transferring parts. A substrate identification mark detector 15 detects a substrate identification mark with the use of a barcode mark which is attached to the substrate to be carried-in from an upstream side to the substrate sorting and transferring part. A substrate kind determining part 22 determines the kind of the substrate from the detection result. Based on the determination result, a control unit 20 reads a mounting program corresponding to the substrate kind from a program storage 21 and changes-over the mounting programs. Consequently, a mounting work is continuously performed with the plurality of mixed kinds of substrates as an object, so that the flexible production form is obtained. COPYRIGHT: (C)2007,JPO&INPIT