FLEXIBLE WIRING BOARD AND ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a flexible wiring board which avoids thermal damage to an insulating layer, and also to provide a high-performance electronic component using the flexible wiring board. SOLUTION: A heat-resistant resin layer 200 and metal foil layers 301, 302 are laminated in this or...

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Bibliographische Detailangaben
Hauptverfasser:	TOMITA HIROFUMI, KAWAKAMI YOSHIO, AKUTSU TOMOYUKI, HITOMI YOSUKE, MATSUMARU YOSHINORI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a flexible wiring board which avoids thermal damage to an insulating layer, and also to provide a high-performance electronic component using the flexible wiring board. SOLUTION: A heat-resistant resin layer 200 and metal foil layers 301, 302 are laminated in this order at least on one surface of a polycarbonate polyurethane resin layer 100 containing an isocyanurate compound as a curing agent. The metal foil layers 301, 302 are patterned. COPYRIGHT: (C)2007,JPO&INPIT