DIE BONDING RESIN PASTE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME, AND SEMICONDUCTOR DEVICE

DIE BONDING RESIN PASTE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SAME, AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide die bonding resin paste which is capable of being easily supplied and applied by a printing method to a support member that is required to be bonded at a comparatively low temperature, and restraining the generation of voids and a decrease in film thickness after it...

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Bibliographische Detailangaben
Hauptverfasser: EHANA SATORU, KAWASUMI MASAO, MORI SHUICHI, DODO TAKASHI, ODAKAWA YASUHISA, HASEGAWA YUJI, ISHII MANABU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide die bonding resin paste which is capable of being easily supplied and applied by a printing method to a support member that is required to be bonded at a comparatively low temperature, and restraining the generation of voids and a decrease in film thickness after it is hardened. SOLUTION: The die bonding resin paste includes an acrylic ester compound or a methacrylic ester compound (A), epoxidized polybutadiene or a carboxy termination acrylonitrile butadiene copolymer (B), a radical initiator (C), and a non-conductive filler (D). Furthermore, the resin paste has a viscosity of 5 to 1,000 Pa s at a temperature of 25°C, and its rate of a change in viscosity with time (48 hours) is ±20% or below at room temperature. COPYRIGHT: (C)2007,JPO&INPIT