SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To provide a semiconductor device wherein the deformation (occurrence of a crack) of a resin substrate upon resin sealing is prevented by a simple means. SOLUTION: To increase the rigidity of the resin substrate upon heating and pressurization thereof, the area occupation perce...
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| creator | MURAI NOBUHIRO |
| description | PROBLEM TO BE SOLVED: To provide a semiconductor device wherein the deformation (occurrence of a crack) of a resin substrate upon resin sealing is prevented by a simple means. SOLUTION: To increase the rigidity of the resin substrate upon heating and pressurization thereof, the area occupation percentage of conductor patterns on the resin sealed side is made ≥70% of the surface of the resin substrate 8 in the semiconductor device 1. Preferably, the spacing between the conductor patterns is set to be ≤0.15 mm. COPYRIGHT: (C)2007,JPO&INPIT |
| format | Patent |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | SEMICONDUCTOR DEVICE |
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