SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device wherein the deformation (occurrence of a crack) of a resin substrate upon resin sealing is prevented by a simple means. SOLUTION: To increase the rigidity of the resin substrate upon heating and pressurization thereof, the area occupation perce...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: MURAI NOBUHIRO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a semiconductor device wherein the deformation (occurrence of a crack) of a resin substrate upon resin sealing is prevented by a simple means. SOLUTION: To increase the rigidity of the resin substrate upon heating and pressurization thereof, the area occupation percentage of conductor patterns on the resin sealed side is made ≥70% of the surface of the resin substrate 8 in the semiconductor device 1. Preferably, the spacing between the conductor patterns is set to be ≤0.15 mm. COPYRIGHT: (C)2007,JPO&INPIT