PLASMA TREATMENT APPARATUS AND PLASMA TREATMENT METHOD

PROBLEM TO BE SOLVED: To improve the cooling efficiency of a substrate by holding the substrate with high adhesiveness to a substrate susceptor in a plasma treatment apparatus, and to uniformize treatment in the entire region on the surface of the substrate including a portion near the periphery edg...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HOUCHIN RIYUUZOU, WATANABE AKIZO, OKITA SHOGO, SUZUKI HIROYUKI, ASAKURA HIROMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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