NOVEL EPOXY RESIN AND HALOGEN-FREE FLAME-RETARDANT EPOXY RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a flame-retardant epoxy resin composition having high-level heat resistance and adhesiveness, and useful as an adhesive for a flexible print circuit board. SOLUTION: The epoxy resin composition comprises: (a) an epoxy resin obtained by a reaction between a phenol com...

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Bibliographische Detailangaben
Hauptverfasser:	WU SHENG YEN, HUANG YU-LIN, KO KONGEN, TO ANHO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a flame-retardant epoxy resin composition having high-level heat resistance and adhesiveness, and useful as an adhesive for a flexible print circuit board. SOLUTION: The epoxy resin composition comprises: (a) an epoxy resin obtained by a reaction between a phenol compound expressed by formula (I) and a compound having epoxy functional groups expressed by formula (II) and formula (III); (b) a toughening agent; and (c) a halogen-free flame-retardant agent. COPYRIGHT: (C)2007,JPO&INPIT