BUNDLING APPARATUS FOR SLIT COIL AND BUNDLING METHOD

PROBLEM TO BE SOLVED: To efficiently and rapidly bundle slit coils with a band. SOLUTION: In a bundling apparatus 100 for slit coils, a bundling band 13 is inserted into a central space 1s of coil pieces 1a-1f, and the inserted bundling band 13 is pulled out to a specified position along the radial...

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Hauptverfasser: ENOEDA SEIJI, KITAHAMA MASANORI, ITABASHI KAZUO, YOSHINAGA YOICHI, NISHINA YOSHIAKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To efficiently and rapidly bundle slit coils with a band. SOLUTION: In a bundling apparatus 100 for slit coils, a bundling band 13 is inserted into a central space 1s of coil pieces 1a-1f, and the inserted bundling band 13 is pulled out to a specified position along the radial direction from a gap between the coil pieces with a bundling band drawing/cutting device 17. The bundling band 13 pulled out to the specified position is cut there, and the ends of the bundling band are bound to horizontally bundle them with the band by using a magic hand 18. COPYRIGHT: (C)2007,JPO&INPIT