CONDUCTIVE MEMBER FOR NON-CONTACT DATA CARRIER AND ITS MANUFACTURING METHOD AND DEVICE

PROBLEM TO BE SOLVED: To easily manufacture a conductive member for a non-contact type data carrier at a low cost. SOLUTION: The punching process of punching a surface side conductive layer (3) by a prescribed pattern from the top of a surface side thermoplastic adhesive layer (5) on the surface of...

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Bibliographische Detailangaben
Hauptverfasser:	MASUBUCHI HIDEO, IGARASHI AKIHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS BOOK COVERS BOOKBINDING CALCULATING COMPUTING COUNTING DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILES HANDLING RECORD CARRIERS INDUCTANCES LOOSE LEAVES MAGNETS MOVABLE-STRIP WRITING OR READING APPARATUS PERFORMING OPERATIONS PHYSICS PRESENTATION OF DATA PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR RECOGNITION OF DATA RECORD CARRIERS RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES SEMICONDUCTOR DEVICES SPECIAL PRINTED MATTER TRANSFORMERS TRANSPORTING WAVEGUIDES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To easily manufacture a conductive member for a non-contact type data carrier at a low cost. SOLUTION: The punching process of punching a surface side conductive layer (3) by a prescribed pattern from the top of a surface side thermoplastic adhesive layer (5) on the surface of a base material (2) and the heat pressing process of heat-pressing it by the prescribed pattern are performed, and the unneeded part (3y) of the surface side conductive layer (3) is removed from the surface of the base material (2). Then, in the state of receiving the surface of the base material (2) by a receiving die (17) having a recess (17a) to which the surface side conductive layer (3) of the prescribed pattern is to be fitted, the punching process of punching a back side conductive layer (4) by the prescribed pattern from the top of a back side thermoplastic adhesive layer (6) on the back surface of the base material (2), and the heat pressing process of heat-pressing it by the prescribed pattern, are performed; and the unneeded part (4y) of the back side conductive layer (4) is removed from the back surface of the base material (2). COPYRIGHT: (C)2007,JPO&INPIT