RESIN MOLDING DEVICE, METHOD FOR MANUFACTURING RESIN MOLDED OBJECT AND RESIN MOLDED OBJECT

PROBLEM TO BE SOLVED: To mold a resin molded object requiring a through hole passing through a face and a back or a space between both sides etc. without generating a weldline. SOLUTION: The resin molding device is equipped with a molding die for forming a cavity which forms the external shape of a...

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Hauptverfasser: MIZUTANI YUJI, SEKINE KAZUYUKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To mold a resin molded object requiring a through hole passing through a face and a back or a space between both sides etc. without generating a weldline. SOLUTION: The resin molding device is equipped with a molding die for forming a cavity which forms the external shape of a molded object, a core etc. moving mechanism which makes the cavity coincide with the shape of a target molded object by introducing a core etc. for forming the through hole in the molded object into the cavity passing through a hole of the molding die, a melted resin injection device for injecting a melted resin into the cavity and a control device. In addition, the molding die has a fitting recessed part which fits into the apex of the core etc. after the cavity of such a shape as to coincide with the shape of the molded object is formed by the introduction of the core etc. moving mechanism. Further, the control device enables the injection of the melted resin into the cavity in a state that the core etc. is half-introduced in the cavity, then moves the core etc. fully introduced into the cavity after the injection, and compresses the melted resin. Further, even after the compression, the control device enables the introduction of the core etc. until the apex of the core etc. fits into the fitting recessed part and thereby, achieves the completion of work to open the through hole. COPYRIGHT: (C)2007,JPO&INPIT