CHIP TYPE SOLID ELECTROLYTIC CAPACITOR AND LEAD FRAME THEREFOR

PROBLEM TO BE SOLVED: To provide a chip-type solid electrolytic capacitor of a lower surface electrode type which has high junction strength between a terminal and an armor resin, and prevents generation of defective appearance. SOLUTION: In the chip-type solid electrolytic capacitor, at least one s...

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Bibliographische Detailangaben
1. Verfasser:	TSUTSUI MAKOTO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ELECTRICITY
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a chip-type solid electrolytic capacitor of a lower surface electrode type which has high junction strength between a terminal and an armor resin, and prevents generation of defective appearance. SOLUTION: In the chip-type solid electrolytic capacitor, at least one surface of an anode terminal 13 and a cathode terminal 12 is formed to be exposed from a packaging resin 16, and an enlarged surface 15 is formed so that a contact area increases in a contact interface to the packaging resin 16 near the tip of the anode terminal 13 and the cathode terminal 12. The mounting surface side of the enlarged surface 15 is provided with a slope 14 so that a board thickness thereof becomes thinner as it gets close to a terminal tip. COPYRIGHT: (C)2007,JPO&INPIT