LAMINATED CIRCUIT SUBSTRATE AND PORTABLE ELECTRONIC EQUIPMENT WITH THE SAME

PROBLEM TO BE SOLVED: To provide a laminated substrate which can prevent local temperature rise. SOLUTION: A signal-amplifying IC2 is mounted on the front surface of the laminated substrate 10 and a ground electrode 34 is formed in a rear surface thereof. The signal-amplifying IC2 is connected to the ground electrode 34 via a ground line, consisting of a conductor pattern formed in the surface of each layer and a plurality of via holes 3, mutually connecting the conductor patterns between adjacent two layers. In each substrate member constituting the laminated substrate 10, a plurality of via holes 3 are formed in the lower region of the signal amplifying IC2 in an uppermost layer 11, and a plurality of via holes 3 are formed at a position where they do not overlap each other in a lamination direction between adjacent two layers in substrate members, excluding the uppermost layer 11. A region wherein a plurality of via holes are formed is enlarged gradually, starting from the lower region of the uppermost layer 11 going toward the ground electrode 34 of the lowermost layer 17 in the out-side direction on a plane orthogonal to the laminating direction. COPYRIGHT: (C)2007,JPO&INPIT