METHOD OF CUTTING FILM MATERIAL HAVING ADHESIVE MATERIAL LAYER

PROBLEM TO BE SOLVED: To provide a method of cutting a film material having an adhesive material layer, which can prevent an adhesive material forming its layer, from running over from a substrate when cutting a film material having the adhesive material layer to a narrow width, can continuously cut...

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Bibliographische Detailangaben
Hauptverfasser: SEKI TAKASHI, OCHI TAKAHITO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method of cutting a film material having an adhesive material layer, which can prevent an adhesive material forming its layer, from running over from a substrate when cutting a film material having the adhesive material layer to a narrow width, can continuously cut with high width accuracy without adhering to the back surface side of the substrate, and does not have an adverse effect on the quality of the film material wound up after being cut. SOLUTION: The film material 20 having the adhesive material layer continuously let out is cut while wetting a contact portion of at least cutting blade 31 with the adhesive material layer by organic fluorinated liquid having a boiling point of 50 to 130°C and a vapor pressure of 30 to 2 kMPa filled in a tray 33. COPYRIGHT: (C)2007,JPO&INPIT