METHOD FOR ATTACHING OPTICAL FILTER TO ENCAPSULATED PACKAGE

PROBLEM TO BE SOLVED: To provide an enhanced method for manufacturing a photonics device which is more efficient and reduces a manufacturing cost. SOLUTION: This method attaches an optical element (414) to an encapsulated electronic package (412). The method can include a step of positioning the opt...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LOKE CHAI LIANG, OON CHIN HIN, KEH KEAN LOO, CHIN YONG KEONG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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