METHOD FOR ATTACHING OPTICAL FILTER TO ENCAPSULATED PACKAGE

METHOD FOR ATTACHING OPTICAL FILTER TO ENCAPSULATED PACKAGE

PROBLEM TO BE SOLVED: To provide an enhanced method for manufacturing a photonics device which is more efficient and reduces a manufacturing cost. SOLUTION: This method attaches an optical element (414) to an encapsulated electronic package (412). The method can include a step of positioning the opt...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LOKE CHAI LIANG, OON CHIN HIN, KEH KEAN LOO, CHIN YONG KEONG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an enhanced method for manufacturing a photonics device which is more efficient and reduces a manufacturing cost. SOLUTION: This method attaches an optical element (414) to an encapsulated electronic package (412). The method can include a step of positioning the optical device (414) to attach it with adhesive (416) to the encapsulated electronic package (412) in a non-singulation state, and curing the whole package. The method can further include a step of carrying out singulation of the encapsulated electronic package (412) in the non-singulation state where the optical device (414) has been attached after the curing. COPYRIGHT: (C)2007,JPO&INPIT