SEMICONDUCTOR STACK

PROBLEM TO BE SOLVED: To easily measure and control contact pressure in a laminated semiconductor element even during or after assembling of a semiconductor stack, and to suppress the degradation of a plate spring. SOLUTION: The semiconductor stack is comprised of a laminated body 5 that is formed by stacking a flat semiconductor element 1 and a heat sink 2. A pair of pressing support plates 6 and 7 and a plate spring 13 interposed between either of the pressing support plates 6 and 7 and the laminated body 5 are provided on both sides in the lamination direction of the laminated body 5, and the laminated body 5 is tightened by them. The plate spring 13 is provided with a cup-shaped spring guide 14 to house the plate spring 13, and a pushing rod 15 is provided between the plate spring 13 and the pressing support plate 7 so as to compress the plate spring 13. When the laminated body 5 is tightened, a gap G between the pressing support plate 7 and the release end 14a of the plate spring guide 14 becomes small. Thus, the gap size is used to measure the quantity of compression of the plate spring 13 as well as control the contact pressure of the semiconductor element 1 of the laminated body 5. COPYRIGHT: (C)2007,JPO&INPIT