SURFACE POLISHING DEVICE

PROBLEM TO BE SOLVED: To obtain a surface polishing device which improves working accuracy by preventing a workpiece and a polishing pad from repeatedly contacting with each other in the same patterns or following the same working trace and also suppresses crashes or scratches of a carrier due to vi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SHIMIZU TOSHIKUNI, NAGAYAMA HITOSHI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To obtain a surface polishing device which improves working accuracy by preventing a workpiece and a polishing pad from repeatedly contacting with each other in the same patterns or following the same working trace and also suppresses crashes or scratches of a carrier due to vibration or flopping of the carrier. SOLUTION: A pad sticking surface 8 and a polishing pad 12 of a lower surface plate 2 among upper and lower surface plates 1 and 2 are formed to be concentric with a rotation center O1 of the lower surface plate 2. In addition, a pad sticking surface 7 and a polishing pad 11 of the upper surface plate 1 are formed to occupy a position eccentric from the rotation center O1 of the upper surface plate 1 and to have a smaller outer diameter and a larger inner diameter than those of the pad sticking surface 7 and the polishing pad 12 of the lower surface plate 2. Further, the workpiece W is made to overhang at both inner and outer peripheral sides of the polishing pad 11 of the upper surface plate 1 among the upper and lower plates 1 and 2. COPYRIGHT: (C)2007,JPO&INPIT