METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To prevent the occurrence of deformation such as warp and distortion of a base substrate, when an insulating layer is disposed over the whole region on the base substrate made of a flexible film. SOLUTION: In the semiconductor device, wiring conductors (electrode pads 2 for bum...

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Bibliographische Detailangaben
Hauptverfasser:	FUJISAWA ATSUSHI, KONNO TAKASHI, ICHITANI MASAHIRO, HARUTA AKIRA, OSAKA SHINGO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prevent the occurrence of deformation such as warp and distortion of a base substrate, when an insulating layer is disposed over the whole region on the base substrate made of a flexible film. SOLUTION: In the semiconductor device, wiring conductors (electrode pads 2 for bump connection, wiring 3, electrode pads 4 for wire connection, and wiring 5 for plating) is arranged on one surface of the base substrate 1 made of the flexible film, and a semiconductor chip 10 is mounted on the surface of the flexible film through an adhesive 12, wherein the insulating layer 9 is divided into a plurality of portions to locate them on each wiring conductor. COPYRIGHT: (C)2007,JPO&INPIT