WAFER WASHING METHOD

PROBLEM TO BE SOLVED: To provide a wafer washing method of single wafer processing which can effectively remove a cleaning liquid dropped on the periphery of wafer. SOLUTION: The method comprises steps of: supplying the cleaning liquid to the surface of wafer 11 while rotating the wafer 11 at a first rotational speed; supplying a rinse liquid to the surface of the wafer 11 while rotating the wafer 11 at a second rotational speed; retaining the rinse liquid at a center portion by supplying the rinse liquid to the center of the surface of the wafer 11 by stopping the rotation of the wafer, or while rotating the wafer 11 at a third rotational speed lower than the first and second rotational speeds; and scattering the rinse liquid retained at the center by rotating the wafer 11 at a fourth rotational speed higher than the first and second rotational speeds. COPYRIGHT: (C)2007,JPO&INPIT