SUBSTRATE LIFTING APPARATUS

PROBLEM TO BE SOLVED: To provide a technology capable of obtaining a state in a processing chamber to be much more tightly closed. SOLUTION: Each of through holes 121 is formed, at a side of a placing face with a substrate W placed thereon, with a valve seat part 121a whose diameter is spread toward...

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Bibliographische Detailangaben
Hauptverfasser:	WASHIO YOSHIAKI, MIYATAKE NAOMASA, MURATA KAZUTOSHI, HATTORI NOZOMI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a technology capable of obtaining a state in a processing chamber to be much more tightly closed. SOLUTION: Each of through holes 121 is formed, at a side of a placing face with a substrate W placed thereon, with a valve seat part 121a whose diameter is spread toward the placing face. Each of the through holes 121 comprises, e.g. a cylindrical part and the valve seat part 121a of a truncated conical shape. Further, each of lift pins 122 has a valve part 122a fitted to the valve seat part 121a. Each lift pin 122 comprises, e.g. the valve part 122a shaped to be a truncated cone and the cylindrical part whose diameter is smaller than that of each through hole 121. Each valve part 122a is fitted to each valve seat part 121a and located to fill in each through hole 121. COPYRIGHT: (C)2007,JPO&INPIT