FLOOR COOLING/HEATING STRUCTURE

PROBLEM TO BE SOLVED: To obtain a floor structure structured so that heat exchange is possible with adjacent water containers for uniformizing the temperatures of the water containers each arranged in space parts partitioned by joists. SOLUTION: The joists 1 are structured by a high heat conduction...

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1. Verfasser: MAEDA SEIICHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To obtain a floor structure structured so that heat exchange is possible with adjacent water containers for uniformizing the temperatures of the water containers each arranged in space parts partitioned by joists. SOLUTION: The joists 1 are structured by a high heat conduction material such as aluminum. In each of the spaces partitioned by the joists 1, the water containers 4 are arranged, respectively, and a floor face 5 is formed at the top part of each of the water containers 4 by laying floor boards. When sun beams S radiate non-uniformly on the entire surface of the floor face 5, heat H of the water container 4 that is the most heated is transferred to adjacent water containers 4 sequentially via the joists 1. As such, each of the water containers 4 become integral thermally, and ultimately, the temperatures of the floor face 5 becomes uniform. COPYRIGHT: (C)2007,JPO&INPIT