RESISTOR ELEMENT HAVING MULTILAYER RESISTIVE MATERIAL

PROBLEM TO BE SOLVED: To provide a resistor foil composed of a copper foil and having various different resistance values. SOLUTION: An interlayer 18 of thickness between 5 and 70 is arranged on a first surface of a copper layer 12. A first layer 14, which is a first resistor metal of thickness betw...

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Bibliographische Detailangaben
Hauptverfasser:	CENTANNI MICHAEL A, CLOUSER SIDNEY J, WANG JIANGTAO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS RESISTORS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resistor foil composed of a copper foil and having various different resistance values. SOLUTION: An interlayer 18 of thickness between 5 and 70 is arranged on a first surface of a copper layer 12. A first layer 14, which is a first resistor metal of thickness between 50 and 2 μm, is arranged on the interlayer 18, and further a second layer 16, which is a second resistor metal of thickness between 50 and 2 μm, is arranged on the first layer 14, which is the first resistor metal. The first resistor metal 14 has the different resistance values from the second resistor metal 16. COPYRIGHT: (C)2007,JPO&INPIT