JOINING HEAD AND JOINING APPARATUS OF ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a joining head of electronic components having a configuration for attaching and detaching a crimp to and from a vibration amplifier and appropriately transmitting suction force generated by a suction apparatus to a suction surface. SOLUTION: The joining head 5 of electronic components for joining a substrate to electronic components 4 comprises: a vibration generator 30; a vibration amplifier 31 for amplifying vibration generated from the vibration generator 30; and a crimp 32 for crimping the electronic components 4 to the substrate while giving vibration amplified by the vibration amplifier 31 to the electronic components 4. The joining head 5 further has an external thread 32b and an internal thread 31d for detachably connecting the crimp 32 to the vibration amplifier 32, and a suction surface 32d for sucking the electronic components 4. In the external thread 32b, a suction hole 32c passing through the external thread 32b in the longitudinal direction of the external thread 32b for sucking the electronic components 4 on the suction surface 32d is formed at the external thread 32b. COPYRIGHT: (C)2007,JPO&INPIT