DEVICE AND METHOD FOR LASER BEAM MACHINING, AND MECHANISM AND METHOD FOR RECOVERING DEBRIS

PROBLEM TO BE SOLVED: To obtain a laser beam machining device, a machining method and a debris recovering mechanism, a recovering method for recovering and storing debris by discharging the debris which are generated when machining a transparent resin layer formed on the surface of a substrate on th...

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Hauptverfasser:	MURASE EIJU, ASO YUKINARI, YAMADA NAOKI, SASAKI YOSHINARI
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING FREQUENCY-CHANGING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PERFORMING OPERATIONS PHYSICS SOLDERING OR UNSOLDERING TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a laser beam machining device, a machining method and a debris recovering mechanism, a recovering method for recovering and storing debris by discharging the debris which are generated when machining a transparent resin layer formed on the surface of a substrate on the upside of the substrate. SOLUTION: In the laser beam machining device, the machining method and the debris recovering mechanism, the recovering method for patterning the transparent resin layer formed on the substrate, when forming the transparent resin layer 8 on the substrate 5, the debris generated when patterning by the laser beam irradiating means 1, 2, 3, 4 are discharged isotropically upward by laser beam irradiating means 1, 2, 3, 4 arranged on the underside of the substrate 5 and the debris recovering mechanism 6 arranged above the substrate 5. COPYRIGHT: (C)2007,JPO&INPIT