ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To suppress the variation of the size of an external electrode in a minute electronic component. SOLUTION: When forming a ground electrode by applying conductive paste on the electronic component, there is previously formed a groove of a predetermined shape in an electronic component element on an application side, and the conductive paste is applied so as to be filled in the groove. It is possible to suppress the variation of the size of the external electrode in the minute electronic component by such an extremely simplified operation. More specifically, the applied conductive paste is fluidized by making use of the surface tension of the conductive paste itself, affinity possessed by a chip surface or of the surface tension and affinity, and even if the tip of the conductive paste is curved and reaches the groove with a time difference, the paste accumulates in the groove successively from the fraction thereof that previously reaches the groove and fills the groove. It is noted that the conductive paste is prevented from spreading beyond the groove until the whole of the groove is filled, so that it is possible to suppress a moon shape as effective as possible without causing a curved edge as in conventional technologies. COPYRIGHT: (C)2007,JPO&INPIT