METHOD FOR APERTURING THIN SHEET MATERIAL

PROBLEM TO BE SOLVED: To provide a method for aperturing a thin sheet material preventing occurrence of layer. SOLUTION: A thin sheet 14 is provided with a first face and a second face, and at least one face of the thin material is substantially coated by adhesive. In this method, thin sheet agent a...

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Bibliographische Detailangaben
Hauptverfasser:	LOUKS JOHN W, JACOBSON RICHARD L, HOFF RANDY A
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CUTTING CUTTING-OUT DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING HAND CUTTING TOOLS PERFORATING PERFORMING OPERATIONS PUNCHING SEVERING SEVERING BY MEANS OTHER THAN CUTTING SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS STAMPING-OUT TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for aperturing a thin sheet material preventing occurrence of layer. SOLUTION: A thin sheet 14 is provided with a first face and a second face, and at least one face of the thin material is substantially coated by adhesive. In this method, thin sheet agent applying adhesive on a patterned anvil having a rising region arranged in a predetermined pattern is provided, height of the rising region is equal to thickness of the thin material or being smaller than it, the thin sheet material receives sufficient amount of sound wave vibration to aperture the thin sheet and adhesive so that the thin sheet and adhesive are apertured generally in the same pattern as the pattern of the raised region on the patterned anvil 32. COPYRIGHT: (C)2007,JPO&INPIT