METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of finely performing patterning treatment on an adhesive layer that connects a semiconductor chip with a substrate. SOLUTION: The method for manufacturing the semiconductor device that sequentially includes (1) a process for affixing an adhesive film to a substrate, (2) a process for performing patterning on the adhesive film by exposing it through a mask 4, (3) a process for developing the adhesive film after exposed, and (4) a process for mounting a chip on a developed adhesive film on the substrate, in this order. The adhesive film is provided with an adhesive layer 2 and a cover film layer 3. The adhesive layer 2 includes (A) a resin having a radical polymerizable double bond, (B) a thermosetting resin, and (C) a resin having an alkali-soluble group and a double bond. COPYRIGHT: (C)2007,JPO&INPIT