OPTICAL SEMICONDUCTOR ELEMENT MODULE AND METHOD OF MANUFACTURING SAME

PROBLEM TO BE SOLVED: To obtain an optical semiconductor element module allowing the area for mounting circuit elements to be made wide on an element mounting surface of a sub-mount. SOLUTION: The module includes a stem having a covered topside with a cap having a laser beam emitting window, a heat...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: ZAIZEN SHIHO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To obtain an optical semiconductor element module allowing the area for mounting circuit elements to be made wide on an element mounting surface of a sub-mount. SOLUTION: The module includes a stem having a covered topside with a cap having a laser beam emitting window, a heat sink block provided on the stem, a sub-mount provided on the heat sink block, optical semiconductor elements provided on the element mounting surface of the sub-mount, and lead pins vertically piercing the stem. The sub-mount has first electrodes provided on the element mounting surface, second electrodes provided on the backside opposite to the element mounting surface, and through-holes piercing the sub-mount to connect the first electrodes to the second electrodes. The optical semiconductor element is connected to the first electrode connected to the lead pin with solder. COPYRIGHT: (C)2007,JPO&INPIT