CIRCUIT CONNECTION STRUCTURAL BODY AND ITS MANUFACTURING METHOD, AND SEMICONDUCTOR SUBSTRATE THEREFOR

PROBLEM TO BE SOLVED: To provide a circuit connection structural body which exhibits excellent adhesion between a heat resistant resin film and a circuit adhesive member even at high temperature and moisture, by introducing a chemically stable functional group into the heat resistant resin film through additional surface treatment and improving adhesion. SOLUTION: In the circuit connection structural body 1A, a semiconductor substrate 2 and a circuit member 3 are adhered with each other by a circuit adhesive member 4 which is pinched with them. A first circuit electrode 5 on the surface of the semiconductor substrate 2, and a second circuit electrode 7 of the circuit member 3, are electrically connected by conductive particles 8 in the circuit adhesive member 4. The semiconductor substrate 2 is subject to surface reforming treatment through plasma processing by using a gas containing nitrogen, ammonia or the like. Therefore, the heat resistant resin film 5 and the circuit adhesive member 4 of the semiconductor substrate 2 are kept adhered rigidly to each other for a long time even at high temperature and moisture. COPYRIGHT: (C)2007,JPO&INPIT