SUBSTRATE-TREATING DEVICE AND SUBSTRATE TREATMENT METHOD

PROBLEM TO BE SOLVED: To perform treatment to a rectangular substrate surface efficiently and uniformly. SOLUTION: The substrate-treating device 1 comprises a treatment liquid supply section 2; a substrate conveyance mechanism 3 for conveying the substrate 9 in a prescribed conveyance direction; a p...

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Bibliographische Detailangaben
Hauptverfasser: KIMURA TAKAHIRO, ARIYAMA DAISAKU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To perform treatment to a rectangular substrate surface efficiently and uniformly. SOLUTION: The substrate-treating device 1 comprises a treatment liquid supply section 2; a substrate conveyance mechanism 3 for conveying the substrate 9 in a prescribed conveyance direction; a plurality of nozzles 4 for jetting treatment liquid droplets; a gas supply section 5 for supplying gas to each nozzle 4; and a control circuit 6. The plurality of nozzles 4 are two-fluid nozzles, where they are arranged at a constant nozzle pitch in a conveyance direction, and each nozzle 4 generates the treatment liquid droplets inside and jets the treatment liquid droplets from a slit-like jet 40 extended vertically in a conveyance direction toward the substrate 9 along with gas. In the substrate-treating device 1, the substrate 9 is rocked at least once in a conveyance direction and its opposite direction within the jet range of the treatment liquid while the treatment liquid droplets are jetted toward a conveyance path from the plurality of nozzles 4, thus preventing treatment irregularities from being generated in the entire treatment region on the substrate 9 and treating the substrate surface efficiently and uniformly. COPYRIGHT: (C)2007,JPO&INPIT