TIN ELECTROPLATING LIQUID, AND TIN ELECTROPLATING METHOD

PROBLEM TO BE SOLVED: To provide a tin electroplating liquid which does not comprise harmful lead, and has excellent solder wettability; and also to provide a method for depositing a tin film on an electronic component or the like using the tin electroplating liquid. SOLUTION: The tin electroplating...

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Bibliographische Detailangaben
Hauptverfasser:	IMANARI MASAAKI, TAKIZAWA YASUSHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a tin electroplating liquid which does not comprise harmful lead, and has excellent solder wettability; and also to provide a method for depositing a tin film on an electronic component or the like using the tin electroplating liquid. SOLUTION: The tin electroplating liquid comprises: stannous ions; an organic acid; and 2-naphthol-7-sulfonic acid or the salt thereof; does not substantially contain lead ions, and contains optionally an oxidation preventive and a surfactant. The organic acid is preferably one or more acids selected from the group composed of alkane sulfonic acid and alkanol sulfonic acid. COPYRIGHT: (C)2007,JPO&INPIT